Problem
Engineering
Problem.
For induction heating, frequency and heating time change penetration depth, heating rate, and uniformity. For laser processing, power and focal depth change the temperature field, gradient, and affected region.
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Thermal-Fluid Intelligence
APPLIED ENGINEERING CASE
Simulation-Led Process Development
Thermal studies for high-frequency heating equipment and laser-wafer process development.
以熱模型比較高周波鋼材加熱與晶圓雷射製程的參數、溫度分布及影響範圍
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Background
Project Background.
This page records two studies that use the same workflow: high-frequency heating of carbon-steel wire and laser processing of power-device wafers. Both required a parameter study before repeated equipment trials.
Engineering
Work Performed
What We
Did.
We built electromagnetic and thermal models, changed one parameter set at a time, and reviewed temperature fields and time histories. The results were used to define settings for the next equipment or process trial.
Deliverables
Project Outputs.
- Model assumptions and boundary conditions
- Frequency, power, focal-depth, and time studies
- Temperature fields, histories, and gradients
- Suggested ranges for the next physical trial
- Equipment and process review material
- Engineering report and exported plots
Process
Work Sequence.
Inputs
Set the geometry, material data, and target temperature
Model
Represent electromagnetic heating and heat transfer
Parameter Runs
Change frequency, power, focal depth, and time
Result Review
Compare fields, histories, gradients, and uniformity
Working Range
Select settings for the next physical trial
Engineering Use
Use the results in equipment and process discussions
Project Material
Images and Outputs.
Contact